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 Pb Free Plating Product
ISSUED DATE :2005/03/28 REVISED DATE :2006/12/12B
GL3055
N-CHANNEL ENHANCEMENT MODE POWER MOSFET
BVDSS RDS(ON) ID
30V 26m 4A
The GL3055 provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SOT-223 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. *Dynamic dv/dt Rating *Simple Drive Requirement *Repetitive Avalanche Rated *Fast Switching
Description
Features
Package Dimensions SOT-223
REF. A C D E I H
Millimeter Min. Max. 6.70 7.30 2.90 3.10 0.02 0.10 0 10 0.60 0.80 0.25 0.35
REF. B J 1 2 3 4 5
Millimeter Min. Max. 13 TYP. 2.30 REF. 6.30 6.70 6.30 6.70 3.30 3.70 3.30 3.70 1.40 1.80
Absolute Maximum Ratings
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current , VGS@10V Continuous Drain Current , VGS@10V Pulsed Drain Current
1
Symbol VDS VGS ID @TA=25 : ID @TA=70 : IDM PD @TA=25 : Tj, Tstg
Ratings 30 20 4.0 3.2 20 2.7 0.02 -55 ~ +150
Unit V V A A A W W/ : :
Total Power Dissipation Linear Derating Factor
Operating Junction and Storage Temperature Range
Thermal Data
Parameter Thermal Resistance Junction-ambient Max. Symbol Rthj-a Value 45 Unit : /W
GL3055
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ISSUED DATE :2005/03/28 REVISED DATE :2006/12/12B
Electrical Characteristics (Tj = 25 : unless otherwise specified)
Parameter Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coefficient
Symbol BVDSS
BVDSS / Tj
Min. 30 1.0 -
Typ. 0.037 5.4 1.3 3.6 3.6 19.8 13 3.2 260 144 13
Max. 3.0 100 25 250 26 40 -
Unit V V/ : V nA uA uA m
Test Conditions VGS=0, ID=250Ua Reference to 25 : , ID=1mA VDS=VGS, ID=250uA VGS= 20V VDS=30V, VGS=0 VDS=24V, VGS=0 VGS=10V, ID=4A VGS=4.5V, ID=3A ID=4A VDS=24V VGS=5V VDS=15V ID=1A VGS=10V RG=3.3 RD=1.9 VGS=0V VDS=25V f=1.0MHz
Gate Threshold Voltage Gate-Source Leakage Current
Drain-Source Leakage Current(Tj=25 : ) Drain-Source Leakage Current(Tj=70 : )
VGS(th) IGSS IDSS
Static Drain-Source On-Resistance Total Gate Charge2 Gate-Source Charge Gate-Drain ("Miller") Change Turn-on Delay Time2 Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
RDS(ON) Qg Qgs Qgd Td(on) Tr Td(off) Tf Ciss Coss Crss
nC
ns
pF
Source-Drain Diode
Parameter Forward On Voltage2
Continuous Source Current(Body Diode) Pulsed Source Current(Body Diode)
1
Symbol VSD IS ISM
Min. -
Typ. -
Max. 1.3 4 20
Unit V A A
Test Conditions IS=2A, VGS=0V, Tj=25 : VD= VG=0V, VS=1.3V
Notes: 1. Pulse width limited by safe operating area. 2. Pulse width 300us, duty cycle 2%.
GL3055
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ISSUED DATE :2005/03/28 REVISED DATE :2006/12/12B
Characteristics Curve
Fig 1. Typical Output Characteristics
45
Fig 2. Typical Output Characteristics
4A
40
A
35
30
25
20
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
Fig 5. Forward Characteristics of Reverse Diode
GL3055
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
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ISSUED DATE :2005/03/28 REVISED DATE :2006/12/12B
4A
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
Fig 11. Switching Time Circuit
Fig 12. Gate Charge Waveform
Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM. GTM reserves the right to make changes to its products without notice. GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems. GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Taiwan: No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C. TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785 China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165
GL3055
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